Aehr Test Systems

Sources - 31

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1. S01primarycompany filing2026-07-27
   Aehr Form 10-K for the fiscal year ended May 29, 2026
   the business description, revenue by category and line, concentration, end-market share, backlog, income statement, cash, the at-the-market sales, share count, deferred tax note, patents, legal proceedings and fiscal-year change
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2. S02primarycompany release2026-07-14
   Aehr fiscal 2026 fourth-quarter release, 8-K Exhibit 99.1
   fourth-quarter revenue and profit, record bookings, effective backlog, the fiscal 2027 guide, the benchmark customer and the photonics win
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3. S03primarycompany release2026-04-07
   Aehr fiscal 2026 third-quarter release, 8-K Exhibit 99.1
   the fiscal 2026 guide and the second-half bookings range
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4. S04primarytranscript2026-07-14
   Aehr fiscal 2026 fourth-quarter earnings call transcript (FMP)
   the AI share of revenue, the lead customer's move from system-level test, the yield argument, Sonoma pricing and the $41M order, the benchmark, memory talks, consumables, supplier prices and Nexus Test

   I believe that burn-in is by far the fastest growing segment in all of semiconductor test right now.

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5. S06primarycompany release2026-07-09
   Aehr release: follow-on order from lead silicon photonics customer
   the first automated system installed and a follow-on order

   This customer took delivery of its first FOX-XP with fully automated WaferPak Aligner production system in fiscal 2026.

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6. S07primarycompany release2026-08-04
   Aehr release: silicon photonics follow-on production order
   a nine-blade system at up to 3,500 watts a blade and its ship date

   The system is expected to ship during the first half of calendar 2027.

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7. S08primarycompany release2026-08-12
   Aehr release: $22 million follow-on order for AI processor wafer-level burn-in
   the order size, what it contains and where it ships

   Aehr expects to ship the systems over the next six months for installation at the customer's high-volume manufacturing partner in Taiwan.

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8. S09primarycompany filing2026-10-06
   Aehr insiders' Forms 4, October 2025 to October 2026 (insider_fetch.py)
   every open-market sale with its price, date, filer and Rule 10b5-1 flag
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9. S10primarycompany filing2026-09-09
   Aehr proxy statement, DEF 14A
   officers and their tenure, beneficial ownership, bonus outcomes and the share-unit targets
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10. S11secondaryvendor data2026-10-06
    AEHR research pack (FMP market tier and FINRA), frozen
    daily prices, the price-move decomposition, valuation history, analyst estimates and ratings, and short interest
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11. S13primarycompany filing2022-08-11
    Aehr Form 10-K for the fiscal year ended May 31, 2022
    fiscal 2022 revenue, costs and share count, and the named customers onsemi, Intel and others
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12. S14primarycompany release2023-07-13
    Aehr fiscal 2023 fourth-quarter release, 8-K Exhibit 99.1
    the fiscal 2024 guide of at least $100M and $28M of net income
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13. S15primarycompany release2024-01-09
    Aehr fiscal 2024 second-quarter release, 8-K Exhibit 99.1
    the guide cut to $75M to $85M
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14. S16primarycompany release2024-04-09
    Aehr fiscal 2024 third-quarter release, 8-K Exhibit 99.1
    the guide cut to more than $65M, made in March
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15. S18primaryindustry data2025-12-16
    SEMI year-end total equipment forecast (via PR Newswire) SEMI
    test equipment sales for 2025 and the drivers SEMI names

    Sales of semiconductor test equipment are projected to surge 48.1% to $11.2 billion in 2025

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16. S19primaryindustry data2026-07-14
    SEMI mid-year total equipment forecast (PR Newswire text, reprinted) SEMI
    test equipment sales for 2026 and 2028

    After surging 55.3% in 2025, semiconductor test equipment sales are projected to increase 31.0% to $15.3 billion in 2026

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17. S20primarytranscript2026-01-15
    TSMC fourth-quarter 2025 earnings call transcript (FMP) TSM
    AI accelerators' share of TSMC revenue and their forecast growth

    we raised our forecast for the revenue growth from AI accelerator to approach a mid- to high 50s percent CAGR for the 5 years period from 2024 to 2029.

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18. S21primarytranscript2026-07-16
    TSMC second-quarter 2026 earnings call transcript (FMP) TSM
    that AI accelerator demand ran ahead of the January forecast

    We don't give you the number today because it continue to increase, so we don't know how to answer this question. Stronger than what we said before.

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19. S22primaryother2020-06-01
    Intel keynote, SW Test Workshop 2020: Moore's Law and the Future of Test (Tadayon) INTC
    a buyer's account of why known-good die matter for chiplet packages

    Despite best efforts to produce KGD out of wafer test, there are still a significant number of defects that are being caught at package test

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20. S23primaryindustry data2021-03-01
    Automotive Electronics Council, AEC-Q101 Rev E base document AEC
    the reverse-bias qualification test and that it is a sample, not a production screen

    This sample size is NOT sufficient or intended for process control or PPM evaluation.

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21. S24primaryother2024-03-01
    onsemi TND6396/D Rev 2: Silicon Carbide, from challenging material to robust reliability ON
    wafer-level burn-in in onsemi's silicon carbide screening flow, vendor unnamed

    Electrical screening is implemented at multiple levels:

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22. S25primaryother2026-10-06
    Semight wafer-level burn-in product page Semight
    a nine-wafer silicon carbide and gallium nitride burn-in system

    Simultaneously perform HTGB and HTRB burn-in tests on 9 wafers

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23. S26primaryother2026-10-06
    Nexustest WLBI3810 product page Nexustest
    the same model numbers as Semight's

    WLBI3810 Wafer Level Burn-In System is a high-end burn-in test equipment specifically designed for Silicon Carbide (SiC) and Gallium Nitride (GaN) wafers

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24. S27primaryother2024-07-01
    Pentamaster Trooper-BI series announcement 7160.KL
    a six-to-eight-wafer silicon carbide burn-in system

    The Trooper-BI series offers a comprehensive, fully automated solution for wafer-level silicon carbide burn-in

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25. S28primaryother2024-07-09
    AEM release: new generation of automated burn-in for AI and HPC chips AWX.SI
    a package-level burn-in rival chosen by an AI chip maker

    its burn-in test system has been selected as the Plan-of-Record solution by a major fabless provider of high-performance compute (HPC) and artificial intelligence (AI) semiconductor chips

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26. S29primaryother2026-10-06
    Advantest system-level test products page 6857.T
    Advantest selling system-level test and burn-in together

    7038 High Parallelism System Level Test (SLT) and Burn-in (BI) Platform

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27. S30primarycompany filing2026-02-19
    Teradyne Form 10-K for 2025 TER
    what its system-level testers do, and no burn-in product
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28. S31primarycompany filing2026-09-24
    Trio-Tech International Form 10-K for the year ended June 30, 2026 TRT
    burn-in equipment and services, burn-in board growth and AI final test in Malaysia
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29. S33primarynews2001-01-01
    Solid State Technology: Wafer-level burn-in with test (Motorola SPS) Motorola
    an early full-wafer burn-in programme at a buyer

    The result was that WLBT was as effective as conventional package level burn-in and did not degrade package reliability.

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30. S34primarycompany release2026-07-14
    Aehr release: more than $8 million in new silicon carbide wafer-level burn-in orders
    the silicon carbide orders and the automaker

    Aehr also received a key order directly from one of the largest automotive companies in the world for multiple WaferPaks

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31. S35secondaryvendor data2026-10-22
    Daily closes to 22 October 2026 (FMP end-of-day prices)
    the 22 October 2026 close of $55.65
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